Samsung's Answer To TSMC's CoWoS Is "SAINT"-- Samsung Advanced Interconnection Technology For Next-Gen Chips

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Samsung is preparing its own chip product packaging service to competing TSMC's CoWoS which is supposedly going to be called SAINT.

Samsung SAINT & TSMC CoWoS Technologies Are Going To Compete To Secure Orders For Advanced Chip Packaging From Major Chipmakers Including NVIDIA & AMD

The current report originates from The Korean Economic Daily which is reporting that the Korean tech giant, Samsung, is preparing its own innovative product packaging service to contend versus the extensively popular CoWoS (Chip-on-Wafer-on-Substrate) product packaging innovation from TSMC.

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It is reported that Samsung prepares to reveal its option next year and will be calling it SAINT or Samsung Advanced Interconnection Technology. That's a really fascinating calling option and it appears like SAINT will be utilized to make a range of various services. There will be 3 kinds of product packaging innovations used by Samsung that include:

  • SAINT S - For vertically stacking SRAM memory chips and CPU
  • SAINT D - For vertically product packaging core IPs such as CPU, GPU, and DRAM
  • SAINT L - For stacking application processors (APs)

Samsung has actually currently passed recognition screening however prepares to broaden its services later on in the coming year after additional screening with customers. There's no doubt that the semiconductor market will gain from a brand-new gamer in the sophisticated product packaging sector. TSMC presently uses its CoWoS services to a series of customers consisting of NVIDIA and AMD for their existing and approaching AI GPUs while Intel is utilizing its own innovative chip production innovations on accelerators such as Ponte Vecchio & its followers.

If all goes according to strategy, Samsung's SAINT has the prospective to acquire a great piece of the marketplace from its enemies though it stays to be seen if business such as NVIDIA and AMD will be pleased with the innovation they have on deal. Everybody understands that innovative product packaging is the method forward as business move far from monolithic styles to chiplet based architectures. The shift in semiconductor style and dependence on sophisticated product packaging has actually led TSMC to broaden its CoWoS centers to stay up to date with the increasing need.

It is likewise being reported by a number of other tech bars that Samsung remains in the race to win a substantial order of HBM memory that will go on to power NVIDIA's next-gen Blackwell AI GPUs. The business had actually simply presented its Shinebolt "HBM3e" memory. The reports from the Korean outlet, Hankooki, recommend that the brand-new offer will mark a significant blow to SK hynix. Samsung likewise won orders from AMD for its next-gen Instinct accelerators however that order was of greatly lower percentages compared to NVIDIA which manages around 90% of the AI market. Both business are likewise anticipated to have HBM3 orders scheduled and offered out till 2025 which provides you an approximation of how huge the need for AI GPUs is right now.

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